Room temperature storable one-part post curable thermally conductive silicone with vertical stability

A curable composition comprising:

• (a) 1.6 to 2.5 weight-percent of a vinyl-functional silicone polymer having two or more vinyl groups per molecule;
• (b) at least one silyl-hydride functional polysiloxane crosslinker that contains at least two silyl-hydride group per molecule and that is present at a concentration to provide a molar ratio of silyl-hydride to vinyl for the composition that is in a range of 0.3 to 1.0;
• (c) a platinum-based hydrosilylation catalyst encapsulated in a thermoplastic polymer, where the thermoplastic polymer has a glass transition temperature in a range of 60 to 80 degrees Celsius as determined by ASTM D7426 over a range of −60 to 200° C. at a ramp rate of 10° C. per minute;
• (d) 93.5 to 96 weight-percent of thermally conductive filler particles other than platelet boron nitride particles;
• (e) 0.2 to 2.5 weight-percent of platelet boron nitride particles;
• (f) 0.1 to 1.0 weight-percent of a polyether additive selected from one or any combination of more than one of a group consisting of polyether-based polymers and polyorganosiloxane-polyoxyalkylene copolymers;
• (g) 0.10 to 5.0 weight-percent of a filler treating agent;
• and
• (h) zero to 0.5 weight-percent of a cure inhibitor;
• with weight-percent relative to curable composition weight.