Porous film with low dielectric property and manufacturing method thereof
AssigneeKyungpook National University Industry-Academic Cooperation Foundation
InventorsKi-Ho NAM, Seongjun KHIM, Yun Chan HWANG
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Abstract
A manufacturing method of a porous polyimide film, includes: preparing a polyamic acid solution at a concentration of 10 to 30 wt % by dissolving a diamine compound and a dianhydride in a solvent; applying the prepared polyamic acid solution to a substrate to prepare a film and then immersing the same in a non-solvent for 30 minutes to 180 minutes; and taking out the immersed film and thermally curing the same; and a porous polyimide film manufactured thereby.
Claims20
A manufacturing method of a porous polyimide film, the method comprising:
- preparing a polyamic acid solution at a concentration of 10 to 30 wt % by dissolving a diamine compound and a dianhydride in a solvent;
- applying the prepared polyamic acid solution to a substrate to prepare a film and then immersing the same in a non-solvent for 30 minutes to 180 minutes;
- and
- taking out the immersed film and thermally curing the same.
A method for preparing a porous polyimide film, the method comprising:
- preparing a surface-modified porous inorganic filler;
- preparing a polyamic acid solution by dissolving a diamine compound and a dianhydride in a solvent and adding the surface-modified porous inorganic filler to the prepared solution;
- applying the polyamic acid solution to which the surface-modified porous inorganic filler is added to a substrate to prepare a film and then immersing the same in a non-solvent;
- and
- taking out the immersed film and thermally curing the same.
Dependencies are inferred from the claim text.