US 2025/0026029 A1Published application

Element pickup mechanism

AssigneesGlobal Unichip Corporation, Taiwan Semiconductor Manufacturing Company, Ltd.

InventorsChih-Chieh LIAO, Yu-Min SUN, Chih-Feng CHENG

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Abstract

An element pickup mechanism includes a pick-up arm and an elastic gasket. The pick-up arm includes a bracket, an air-extraction pipe and a suction cup. The bracket is provided with an inner space and an opening that is formed on one side of the bracket and in communication with the inner space. The air-extraction pipe is disposed on the bracket and connected to a vacuum pump equipment. The suction cup is sleeved on one end of the air-extraction pipe, located in the inner space and faced towards the opening of the bracket. The elastic gasket includes a flexible pad and a through hole. The flexible pad is formed with a flat surface and an attached surface that is fixedly attached to the side of the bracket. The through hole penetrates through the flexible pad to coaxially align with the opening and the suction cup.

Claims20

Dependent claims

An element pickup mechanism, comprising:

a pick-up arm comprising:
a bracket that is provided with an inner space and a first opening formed on one side of the bracket and being in communication with the inner space;
an air-extraction pipe that is disposed on the bracket and used to connect to a vacuum pump equipment;
and
a suction cup that is sleeved on one end of the air-extraction pipe, located in the inner space and facing towards the first opening of the bracket;
an elastic gasket comprising:
a flexible pad formed with a flat surface and an attached surface which are opposite to each other, the attached surface is fixedly attached to the one side of the bracket;
and
a through hole penetrating through the flexible pad to coaxially align with the first opening and the suction cup,
wherein when the flat surface of the flexible pad directly covers a packaged chip and a suction nozzle of the suction cup covers the first opening, the air-extraction pipe sucks the packaged chip onto the flexible pad by vacuum pumping through the through hole.

7 more elements

An element pickup mechanism, comprising:

a flexible pad having a first surface and a second surface which are opposite to each other, the flexible pad that is formed with a through hole penetrating through the flexible pad to be connected to the first surface and the second surface, and the first surface that is used to press a packaged chip;
a bracket that is connected to the second surface of the flexible pad;
and
an air-extraction pipe comprising a pipe main body and a suction cup, the pipe main body that is liftably passed through the bracket, and one end of the pipe main body that is connected to a vacuum pump equipment, and another end of the pipe main body that is sleeved on the suction cup, and an inner portion of the pipe main body being in communication with the through hole through the suction cup, so that the vacuum pump equipment is able to vacuum-adsorbed the packaged chip onto the flexible pad through the air-extraction pipe and the through hole.

1 more element

Dependencies are inferred from the claim text.