Apparatus for an inert anode plating cell

Abstract

An electroplating apparatus for wafer electroplating includes a wafer holder, a plating cell containing electrolyte, and a membrane-less anode chamber within the plating cell. The chamber houses an apertured charge plate and a meshed anode positioned above it. The configuration forces all electrolyte flow through the charge plate and meshed anode upwardly to the wafer. Standoff pins support the meshed anode above the charge plate at a selected distance. A flow-shaping plate may be positioned between the wafer and meshed anode. The meshed anode can be a composite of multiple displaced layers, creating varied pores. The charge plate includes precisely spaced and sized holes. Methods of using the apparatus involve providing these components, disposing the chamber within the plating cell, containing electrolyte, and forcing flow upward through the charge plate and meshed anode to the wafer. This design enhances irrigation flow and improves plating formation.

Dependencies are inferred from the claim text.