Polyamic acid varnish, polyimide composition, and adhesive
AssigneeMitsui Chemicals, Inc.
InventorsKo TAKASE, Masaki OKAZAKI, Yuichi TSUKADA
Life of this patent
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Abstract
A polyamic acid varnish according to the present disclosure contains a polyamic acid. The monomers that constitute this polyamic acid include: a monomer (A) that has a C4-12 linear alkylene group but does not have an ester bond, an amide bond, or an ether bond; and a monomer (B) that is a monomer other than the monomer (A). The monomer (A) content is 15 to 70 mol % with respect to the total amount of the monomers that constitute the polyamic acid. The monomer (B) contains at least 90 mol % aromatic monomer.
Claims16
A polyamic acid varnish comprising a polyamic acid, wherein:
- a monomer constituting the polyamic acid contains
- a monomer (A) that has a linear alkylene group having 4 to 12 carbon atoms and has no ester bond, amide bond, and ether bond, and
- a monomer (B) other than the monomer (A);
- a content of the monomer (A) is 15 to 70 mol % based on a total amount of the monomer constituting the polyamic acid;
- and
- the monomer (B) contains 90 mol % or more of an aromatic monomer.
A polyimide composition comprising a polyimide, wherein:
- a monomer constituting the polyimide contains
- a monomer (A) that has a linear alkylene group having 4 to 12 carbon atoms and has no ester bond, amide bond, and ether bond, and
- a monomer (B) other than the monomer (A);
- a content of the monomer (A) is 15 to 70 mol % based on a total amount of the monomer constituting the polyimide;
- and
- the monomer (B) contains 90 mol % or more of an aromatic monomer.
Dependencies are inferred from the claim text.