Thermally conductive silicone rubber composition

A thermally conductive silicone rubber composition, which comprises the following components:

• a) a polydiorganosiloxane having a degree of polymerisation of at least 2,500 calculated from the number average molecular weight determined by gel permeation chromatography and at least two unsaturated groups per molecule, which unsaturated groups are selected from alkenyl or alkynyl groups;
• b) an organosilicon compound having at least two, optionally at least three Si—H groups per molecule;
• (c) at least one thermally conductive filler with a volume median particle diameter of 0.1-100 micrometers (μm) measured by laser diffraction particle size analysis,
• in an amount of from 80 to 95 wt. % of the composition;
• d) an organopolysiloxane filler treating agent having a degree of polymerisation of from about 4 to 500 calculated from the number average molecular weight determined by gel permeation chromatography and comprising;
• (i) at least one alkenyl group per molecule, and
• (ii) at least one hydroxy group or at least one alkoxy group or a mixture of hydroxy and alkoxy groups per molecule;
• in an amount of from 0.1-10% wt. of the composition;
• and
• e) a hydrosilylation catalyst comprising or consisting of a platinum group metal or a compound thereof;
• wherein the total wt. % of the composition is 100 wt. %.