Thermosetting resin composition, thermally conductive resin sheet, heat-dissipating layered product, heat-dissipating circuit board, semiconductor device and power module

Abstract

A thermosetting resin composition containing a thermosetting resin, an inorganic filler, and a polymer having a mass average molecular weight of 10,000 or more, wherein the thermosetting resin composition includes boron nitride agglomerated particles as the inorganic filler, and includes an epoxy compound and a benzoxazine compound as the thermosetting resin, and a ratio of a mass content of the boron nitride agglomerated particles to a mass content of the benzoxazine compound (boron nitride agglomerated particles/benzoxazine) is 5 or more and 50 or less, a thermally conductive sheet having thermal conductivity and heat resistance can be formed. In addition, the thermosetting resin composition can be formed into a film without any problem when forming a sheet, and sufficient adhesive strength can be obtained when cured.

Dependencies are inferred from the claim text.