Sealing structure and material containing device including the same
AssigneeSamsung Electronics Co., Ltd.
InventorsWooram HONG, Hyun Do CHOI, Dal HEO, Youngchun KWON, Hyukju KWON, Gahee KIM, Bosung KIM, Jeonghun KIM, Jin Woo KM, Min Sik PARK, Youngjin PARK, Hyungtae SEO, Won Seok OH, Dongseon LEE, Sangyoon LEE, Jaejun CHANG, Jun Won JANG, Hyunjeong JEON, Joon-Kee CHO, Byung-Kwon CHOI, Won Je CHOI, Younsuk CHOI, Taesin HA
Life of this patent
Estimating the term…