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US 2025/0018509 A1Published application
Solder alloy, joined part, joining material, solder paste, joined structure, and electronic control device
AssigneeTamura Corporation
InventorsTakanori SHIMAZAKI, Tomoki ASANO, Masaya ARAI
Life of this patent
Estimating the term…
Abstract
A solder alloy includes 35 mass % or more and 65 mass % or less of Bi, 0.1 mass % or more and 0.65 mass % or less of Sb, 0.05 mass % or more and 2 mass % or less of Ag, and a balance including Sn and an inevitable impurity.
Claims20
A solder alloy comprising:
- 35 mass % or more and 65 mass % or less of Bi;
- 0.1 mass % or more and 0.65 mass % or less of Sb;
- 0.05 mass % or more and 2 mass % or less of Ag;
- and
- a balance including Sn and an inevitable impurity.
2 more elements
A joining material comprising:
- a solder alloy comprising;
- 35 mass % or more and 65 mass % or less of Bi;
- 0.1 mass % or more and 0.65 mass % or less of Sb;
- 0.05 mass % or more and 2 mass % or less of Ag;
- and
- a balance including Sn and an inevitable impurity.
3 more elements
A solder paste comprising:
- a powder made of a solder alloy comprising;
- 35 mass % or more and 65 mass % or less of Bi;
- 0.1 mass % or more and 0.65 mass % or less of Sb;
- 0.05 mass % or more and 2 mass % or less of Ag;
- and
- a balance including Sn and an inevitable impurity;
- and
- a flux comprising;
- a base resin;
- a thixotropic agent;
- an activator;
- and
- a solvent.
10 more elements
Dependencies are inferred from the claim text.