Micromachined ultrasonic transducer device with high quality factor

A process of manufacturing a micromachined ultrasonic transducer, comprising:

• forming a die including a semiconductor material, a main surface, and having one or more ultrasonic cells;
• introducing the die into an opening of an electrical connection board;
• electrically coupling the die to the electrical connection board;
• and
• forming a soft region above the main surface of the die, the soft region adhering to the electrical connection board to the die.

A micromachined ultrasonic transducer, comprising:

• an electrical connection board including a through opening extending entirely through the electrical connection board, and one or more through opening sidewalls of the electrical connection board delimits the through opening;
• a die present within the through opening, the die including a third surface and a fourth surface opposite to the third surface, the die is electrically coupled to the electrical connection board;
• and
• a soft region extending from the electrical connection board across the through opening to the fourth surface of the die, the soft region is on the fourth surface of the die and physically couples the electrical connection board to the die.