Apparatus and method for plasma treatment of a substrate using automatic water replenishment

An apparatus for treating a substrate, the apparatus comprising:

• (i). a water supply tank further comprising:
• a level line;
• a reservoir filled with water to the level line;
• (ii). a control module capable of network interface, display, storage, processing and system instructional output communicatively connected to at least an external water supply line, the water supply tank, and connected with a plurality of system sensors, and configured to generate at least one control signal;
• (iii). a reaction chamber communicatively connected to the water supply tank and the control module, the reaction chamber comprising:
• a pair of electrodes including a first electrode and a second electrode positioned opposite to the first electrode;
• and
• a reaction region defined between the first electrode and the second electrode, the reaction region configured to at least temporarily retain the substrate;
• (iv). an injector communicatively connected to the control module, wherein the injector connects the water supply tank to the reaction chamber and is configured to generate a dispersion of a plurality of microfine water droplets from water extracted from the reservoir in response to receipt of at least one control signal;
• (v). an ignition system, configured to detect and respond to at least one control signal from the control module;
• and
• (vi). a plurality of sensors configured to collect, store and process qualitative and quantitative reaction information including electrical voltage and discharge data as well as current, temperature, moisture and optical data, and send reaction information including electrical discharge parameters, fluid parameters, and growth medium parameters, and supply reaction information to the control module.