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US 2024/0429013 A1Published application
Fuse and Method of Fabricating the Same
AssigneeLG Energy Solution, Ltd.
InventorsChang Bog Lee, Sang Eun Jung, Sung Gyu Kim
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Abstract
A fuse according to an embodiment disclosed herein includes a printed circuit board (PCB); a conductive pattern disposed on the PCB; a film disposed at lateral sides of the conductive pattern or on a partial region of the conductive pattern to leave an open region; and a coating disposed on the conductive pattern and the film.
Claims13
A fuse comprising:
- a printed circuit board (PCB);
- a conductive pattern disposed on the PCB;
- a film disposed at lateral sides of the conductive pattern or on a partial region of the conductive pattern to leave an open region;
- and
- a coating disposed on the conductive pattern and the film.
2 more elements
A method of fabricating a fuse, comprising:
- forming a conductive pattern disposed on a printed circuit board (PCB);
- forming a film disposed at lateral sides of the conductive pattern or on a partial region of the conductive pattern to leave an open region;
- and
- forming a coating disposed on the conductive pattern and the film.
1 more element
Dependencies are inferred from the claim text.