Microneedles and method for their manufacture
AssigneeIQS GROUP s.r.o.
InventorsTomas Tethal, Stepan Cerny
Life of this patent
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AssigneeIQS GROUP s.r.o.
InventorsTomas Tethal, Stepan Cerny
Estimating the term…
A method for the manufacture of one or more (especially hollow) microneedles (16), e.g. in the form of an array, patch or chip of side-by-side arranged microneedles, e.g. for delivering a pharmaceutical composition to the skin of a subject over an area thereof, the method comprising: (i) providing a substrate structure (14) of electrically insulating material including one or more concavities (12) extending into the body of the substrate structure (14) from a face thereof, the one or more concavities (12) being internally shaped and configured so as to correspond to the external shape and configuration of the respective one or more microneedles (16) to be formed; (ii) applying selectively to at least one first surface or surface portion of each of the said one or more concavities (12), and especially not in lower open-tip-forming regions 18 thereof, a layer (8) of an electrically conductive material; and (iii) using a galvanoplastic technique, depositing on each layer (8) of electrically conductive material in the said one or more concavities (12) at least one layer or body of microneedle wall-forming material (16) so as build up a wall (16) of a respective microneedle in each respective said concavity (12).
A method for the manufacture of one or more microneedles, the method comprising:
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Dependencies are inferred from the claim text.