Multi-core chip, integrated circuit apparatus, and board card and manufacturing procedure method therefor

A board card, comprising a multi-core chip, the multi-core chip comprising:

• a first core layer including:
• a first operation area in which a first operation circuit is generated, and
• a first die-to-die area in which a first transceiver circuit is generated;
• and
• a second core layer including:
• a second operation area in which a second operation circuit is generated, and
• a second die-to-die area in which a second transceiver circuit is generated, wherein
• the first core layer and the second core layer are vertically stacked, and the first operation circuit and the second operation circuit transfer data between layers through the first transceiver circuit and the second transceiver circuit.

A method for manufacturing a multi-core chip, comprising:

• generating a first core layer including
• a first operation area in which a first operation circuit is generated, and
• a first die-to-die are in which a first transceiver circuit is generated;
• and
• generating a second core layer including
• a second operation area in which a second operation circuit is generated, and
• a second die-to-die area in which a second transceiver circuit is generated, wherein the first core layer and the second core layer are vertically stacked, and the first operation circuit and the second operation circuit transfer data between layers through the first transceiver circuit and the second transceiver circuit.