Component mounting device

A component mounting device comprising:

• a suction nozzle configured to be supplied with negative pressure air to perform pickup operation of picking up a component, and configured to be blocked from the negative pressure air to perform mounting operation of mounting the component on a board;
• a first negative pressure supply section configured to supply the negative pressure air to the suction nozzle throughout a time band from when the suction nozzle starts the pickup operation to when the suction nozzle starts the mounting operation;
• a second negative pressure supply section configured to supply the negative pressure air to the suction nozzle;
• a negative pressure detection section configured to directly or indirectly detect a pressure value of the negative pressure air supplied to the suction nozzle;
• and
• a negative pressure supply control section configured to operate the second negative pressure supply section when the detected pressure value of the negative pressure air is closer to an atmospheric pressure value than a predetermined value set between the atmospheric pressure value and a vacuum value.