Hybrid and adaptive cooling mechanisms
AssigneeIntel Corporation
InventorsFrancesc Guim Bernat, Karthik Kumar, Uzair Qureshi, Marcos Carranza, Marek Piotrowski
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Abstract
Hybrid and adaptive cooling systems are described. A method comprises selecting a cooling system type from a set of cooling system types of a hybrid cooling system to cool an electronic component of an electronic device, generating a control directive to activate a cooling component of the cooling system type, and performing thermal management of the electronic component of the electronic device using the cooling component of the cooling system type. Other embodiments are described and claimed.
Claims20
A method comprising:
- selecting a cooling system type from a set of cooling system types of a hybrid cooling system to cool an electronic component of an electronic device;
- generating a control directive to activate a cooling component of the cooling system type;
- and
- performing thermal management of the electronic component of the electronic device using the cooling component of the cooling system type.
A computing apparatus comprising:
- circuitry;
- and
- a memory storing instructions that, when executed by the circuitry, causes the circuitry to:
- select a cooling system type from a set of cooling system types of a hybrid cooling system to cool an electronic component of an electronic device;
- generate a control directive to activate a cooling component of the cooling system type;
- and
- perform thermal management of the electronic component of the electronic device using the cooling component of the cooling system type.
A non-transitory computer-readable storage medium, the computer-readable storage medium including instructions that when executed by circuitry, cause the circuitry to:
- select a cooling system type from a set of cooling system types of a hybrid cooling system to cool an electronic component of an electronic device;
- generate a control directive to activate a cooling component of the cooling system type;
- and
- perform thermal management of the electronic component of the electronic device using the cooling component of the cooling system type.
Dependencies are inferred from the claim text.