Airflow distribution to cool memory module shadowed by the processor

A cooling system comprising:

• a heatsink for a processor device;
• heatsinks for memory modules surrounding the processor device, including a heatsink over a downstream memory module that is downstream with respect to the processor device, with respect to a direction of a flow of a cooling fluid to cool the processor and the memory modules;
• and
• a fluid bypass to direct cooling fluid to the downstream memory module, wherein cooling fluid passing through the fluid bypass is directed to the downstream memory module without first being used to cool the processor device.