X-y shielding of signal paths within pcbs

A method of making a printed circuit board, the method comprising:

• arranging a plurality of layers to form a stack such that inner layers of the stack are arranged between outer copper layers and include copper coated substrates alternated with pre-preg layers;
• thermocompressing the stack such that the pre-preg layers are forced into gaps in the copper coatings and such that the outer copper layers bend around a perimeter of the inner layers;
• and
• separating a printed circuit board from the thermocompressed stack.

A method of making a printed circuit board, the method comprising:

• forming a plurality of laminated cores including etching copper layers laminated on substrates;
• forming a stack such that topmost and bottommost layers of the stack are further copper layers and such that inner layers of the stack include pre-preg layers alternated with the laminated cores;
• thermocompressing the stack such that the pre-preg layers conform to the etched copper layers to form a panel and such that the further copper layers bend around a perimeter of the panel;
• and
• separating a printed circuit board from the panel such that the printed circuit board's widest extent defines its final width.