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US 2024/0407098 A1Published application
Module and apparatus
AssigneeCanon Kabushiki Kaisha
InventorsMITSUTOSHI HASEGAWA, NORITAKE TSUBOI, SATORU HIGUCHI
Life of this patent
Estimating the term…
Abstract
A first wiring board, a first component mounted on the first wiring board, a second wiring board overlapping the first wiring board, a second component mounted on the second wiring board, and a connecting member disposed between the first wiring board and the second wiring board, the connecting member being soldered to the first wiring board and the second wiring board, the connecting member electrically connecting the first wiring board to the second wiring board, are provided.
Claims20
A module comprising:
- a first wiring board;
- a first component that is an electrooptical component mounted on the first wiring board;
- a second wiring board overlapping the first wiring board;
- a second component that is an integrated circuit component mounted on the second wiring board;
- and
- a connecting member disposed between the first wiring board and the second wiring board, the connecting member being soldered to the first wiring board and the second wiring board, the connecting member electrically connecting the first wiring board to the second wiring board.
3 more elements
Dependencies are inferred from the claim text.