Covers for integrated circuit package sockets
AssigneeIntel Corporation
InventorsAriatne Ramirez Macias, Allison Van Horn, Kristin L. Weldon, Israel Cruz Ruiz, Fernando Gonzalez Lenero, Min Pei, Francisco Javier Colorado Alonso, Randall Scott Sanford, Emery Evon Frey, Eric W. Buddrius
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