Carrier structure

Abstract

A carrier structure is provided, in which a ground layer is formed on a dielectric body, a circuit layer is formed in the dielectric body, and a conductive via is formed in the dielectric body and electrically connected to the circuit layer and the ground layer, where the ground layer has at least one first groove that exposes a surface of the dielectric body, so that the noise of the circuit layer is easy to spread out of the dielectric body, so as to prevent the problem of crosstalk from occurring in the circuit layer.

Dependencies are inferred from the claim text.