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US 2024/0407077 A1Published application
Printed circuit board and method of manufacturing the same
AssigneeRolls-Royce Deutschland Ltd & Co KG
InventorsUwe WALTRICH, Stanley BUCHERT
Life of this patent
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Abstract
A circuit board includes a plurality of circuit board layers arranged one on top of the other, wherein through-holes are integrated in the circuit board, wherein the through-holes are configured to receive metal screws that screw the circuit board to a heat sink. Insulating sleeves made of an insulating material are integrated into the circuit board, wherein the through-holes are formed in the circuit board in the region of the insulating sleeves.
Claims18
A circuit board comprising:
- a plurality of circuit board layers arranged one on top of another;
- through-holes configured to receive metal screws that screw the circuit board to a heat sink being integrated into the circuit board;
- and
- insulating sleeves integrated into the circuit board,
- wherein the insulating sleeves comprise an insulating material, and
- wherein the through-holes are formed in the circuit board in a region of the insulating sleeves.
3 more elements
A method for producing a circuit board, the method comprising:
- providing a circuit board having a plurality of circuit board layers arranged one on top of another;
- milling a cavity into the circuit board, the cavity involving at least some of the circuit board layers of the circuit board;
- inserting an insulating sleeve made of an insulating material into the cavity;
- filling a free volume in the cavity that extends between the inserted insulating sleeve and a rim of the cavity with a plastics material when the free volume is present after the insulating sleeve has been inserted;
- and
- drilling a through-hole through the insulating sleeve.
3 more elements
Dependencies are inferred from the claim text.