Packaged acoustic wave devices with multilayer piezoelectric substrate
AssigneeSkyworks Solutions, Inc.
InventorsRei Goto, Hironori Fukuhara, Atsushi Takano
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Abstract
Aspects and embodiments disclosed herein include a packaged acoustic wave component comprising a base layer, an acoustic wave filter disposed on an upper side of the base layer, a cap layer mounted to the upper side of the base layer such that a bottom side of the cap layer faces the upper side of the base layer, and an electrical shield layer disposed on the bottom side of the cap layer such that the electrical shield layer and the acoustic wave filter are positioned between the base layer and the cap layer.
Claims20
A packaged acoustic wave component comprising:
- a base layer;
- an acoustic wave filter disposed on an upper side of the base layer;
- a cap layer mounted to the upper side of the base layer such that a bottom side of the cap layer faces the upper side of the base layer;
- and
- an electrical shield layer disposed on the bottom side of the cap layer such that the electrical shield layer and the acoustic wave filter are positioned between the base layer and the cap layer.
A radio frequency module including a packaged acoustic wave component, the packaged acoustic wave component comprising:
- a base layer;
- an acoustic wave filter disposed on an upper side of the base layer;
- a cap layer mounted to the upper side of the base layer such that a bottom side of the cap layer faces the upper side of the base layer;
- and
- an electrical shield layer disposed on the bottom side of the cap layer such that the electrical shield layer and the acoustic wave filter are positioned between the base layer and the cap layer.
A wireless communication device comprising a radio frequency module including a packaged acoustic wave component, the packaged acoustic wave component including a base layer, an acoustic wave filter disposed on an upper side of the base layer, a cap layer mounted to the upper side of the base layer such that a bottom side of the cap layer faces the upper side of the base layer, and an electrical shield layer disposed on the bottom side of the cap layer such that the electrical shield layer and the acoustic wave filter are positioned between the base layer and the cap layer.
A method of making a packaged acoustic wave component, the method comprising:
- forming a base layer;
- forming an acoustic wave filter disposed on an upper side of the base layer;
- forming a cap layer for mounting to the upper side of the base layer such that a bottom side of the cap layer faces the upper side of the base layer;
- and
- forming an electrical shield layer disposed on the bottom side of the cap layer such that the electrical shield layer and the acoustic wave filter are positioned between the base layer and the cap layer.
Dependencies are inferred from the claim text.