Optical detection module and related manufacturing method

A manufacturing method applied for chip scale package technology, the manufacturing method comprising:

• disposing a plurality of chip scale package assemblies without conductive contacts spaced from each other on a carrier;
• disposing a sheltering layer on conductive units of the plurality of chip scale package assemblies;
• filling light sheltering material into a gap formed between two adjacent chip scale package assemblies of the plurality of chip scale package assemblies;
• removing the sheltering layer to dispose the conductive contacts respectively on the conductive units;
• removing the carrier;
• and
• trimming the light sheltering material in the middle to form two light sheltering layers attached to the two adjacent chip scale package assemblies respectively, so that the two adjacent chip scale package assemblies with its own light sheltering layers respectively are separated to set as two optical detection modules.

An optical detection module applied for chip scale package technology, comprising:

• a chip scale package assembly, comprising:
• a glass substrate;
• a detection chip located above the glass substrate;
• an isolation layer disposed on a surface of the detection chip opposite to the glass substrate;
• a plurality of redistribution layers disposed on the isolation layer and spaced from each other, and having a plurality of conductive units;
• and
• a plurality of conductive contacts respectively disposed on the plurality of conductive units;
• and
• a light sheltering layer disposed on a lateral surface of the chip scale package assembly, and adapted to block light transmission and provide a covering protection function.