Method of fabricating led light plate, led light plate, and display device

An LED light plate, fabricated by a method comprising:

• disposing a functional layer on a surface of each of a plurality of LED chips to form a plurality of chips to be transferred;
• placing the plurality of chips to be transferred into a receiving tank filled with a suspension;
• defining a plurality of grooves each matching a shape of the functional layer in a transport substrate;
• placing the transport substrate into the suspension, making a first electrode disposed in the receiving tank be situated opposite to a second electrode disposed in each groove, and making each chip to be transferred be located between the first electrode and the respective second electrode;
• energizing the first electrode and each second electrode, enabling each chip to be transferred to be absorbed by the transport substrate, and causing each functional layer to move into the respective groove;
• and
• transplanting the plurality of chips to be transferred on the transport substrate onto a target substrate;
• wherein each functional layer is filled with a plurality of charged particles.

A display device, comprising a display panel and a backlight module, the display panel being disposed opposite to the backlight module, wherein the backlight module comprises the LED light plate configured to provide backlight for the display panel, wherein the LED light plate is fabricated by a method comprising:

• disposing a functional layer on a surface of each of a plurality of LED chips to form a plurality of chips to be transferred;
• placing the plurality of chips to be transferred into a receiving tank filled with a suspension;
• defining a plurality of grooves each matching a shape of the functional layer in a transport substrate;
• placing the transport substrate into the suspension, making a first electrode disposed in the receiving tank be situated opposite to a second electrode disposed in each groove, and making each chip to be transferred be located between the first electrode and the respective second electrode;
• energizing the first electrode and each second electrode, enabling each chip to be transferred to be absorbed by the transport substrate, and causing each functional layer to move into the respective groove;
• and
• transplanting the plurality of chips to be transferred on the transport substrate onto a target substrate;
• wherein each functional layer is filled with a plurality of charged particles.