Cover structure for beamshaping for light emitting diode packages

Abstract

Solid-state lighting devices, and more particularly, cover structures for beamshaping for multi-chip light emitting diode (LED) components are disclosed. The cover structure can reduce the far field emission pattern variation due to having different light emission sources on a multi-chip LED component. The cover structure can include channels, or tunnels, within an otherwise light-transmissive material that perform beamshaping of at least a portion of the light emitted from the multiple LED chips. The beamshaping can be a result of a predetermined orientation and/or distribution pattern of the channels that redirect the light. The cover structure can also include textured surfaces or light-altering materials that can further diffuse the light emitted from the multi-chip LED component.

Dependencies are inferred from the claim text.