Package body and preparation method therefor

A method for preparing a package body, comprising:

• obtaining a processed plate, wherein the processed plate comprises a carrier plate and a first plastic packaging layer, the carrier plate is arranged with one or more first pads disposed on each of opposite sides of the carrier plate, and the first plastic packaging layer is attached to the each of the opposite sides of the carrier plate;
• preparing a connecting member on a side of the first plastic packaging layer away from the carrier plate, performing a depth-controlled operation on a preset position of the first plastic packaging layer until a cross section of the connecting member is exposed, and forming a depth-controlled groove, wherein the connecting member is connected to a corresponding one of the one or more first pads, and the preset position is partially overlapped with the connecting member;
• mounting a chip upright in the depth-controlled groove, wherein a side surface of the chip is connected to the connecting member;
• and
• forming a second plastic packaging layer on the side of the first plastic packaging layer away from the carrier plate, dividing the carrier plate into at least two package bodies.