Electronic device

An electronic device, comprising:

• a substrate comprising a through hole;
• a connecting element disposed in the through hole;
• a first insulating layer disposed on the substrate and comprising a first via;
• a first conductive element disposed on the first insulating layer and electrically connected to the connecting element through the first via;
• a second conductive element and a third conductive element disposed on the first conductive element, wherein the second conductive element and the third conductive element are separated from each other by a space;
• a second insulating layer disposed in the space;
• a fourth conductive element disposed under the substrate and electrically connected to the connecting element;
• and
• a semiconductor disposed between the substrate and the first insulating layer,
• wherein, in a cross-sectional view of the electronic device, at least one of the second conductive element and the third conductive element is not overlapping with the connecting element.