Semiconductor package and method for forming the same

A method for forming a semiconductor package, comprising:

• forming a redistribution structure on a substrate;
• disposing a first photonic routing structure on the redistribution structure, comprising:
• forming a recess having a curved surface in an optical interposer die;
• forming a first dielectric structure covering the curved surface, wherein a first waveguide is embedded in the first dielectric structure;
• and
• forming a reflective element over the first dielectric structure;
• disposing a second photonic routing structure and an optical engine die on the redistribution structure, wherein the second photonic routing structure comprises a second dielectric structure and a second waveguide disposed in the second dielectric structure, the optical engine die is disposed on the second photonic routing structure, and the second waveguide is optically coupled to the first waveguide and the optical engine die.

A semiconductor package, comprising:

• a substrate;
• a redistribution structure formed on the substrate;
• a first photonic routing structure disposed on the redistribution structure;
• an optical interposer die disposed on the first photonic routing structure;
• a second photonic routing structure disposed on the redistribution structure;
• an optical engine die disposed on the second photonic routing structure;
• and
• a molding structure disposed between the first photonic routing structure and the second photonic routing structure.