Molding composition, semiconductor package and method of fabricating the same

A semiconductor package, comprising:

• a first package, comprising:
• a semiconductor die;
• an insulating encapsulant surrounding the semiconductor die, wherein the insulating encapsulant is formed from a molding composition comprising a stress relaxation agent composed of silicone oil, wherein the stress relation agent is at least one compound selected from the group of compounds represented by formula (1):
• wherein, in formula (1), X is independently CH3, C2H5, C3H7, C6H5, C10H7, C12H9, Y is independently CH3, C2H5, C3H7, C6H5, C10H7, C12H9, R is independently CH2, C2H4, C3H6, OCH2, OCH4, OC3H6, OC2H2, C2H2O, C3H4O, C4H6O, and n is 1-100;
• and
• a redistribution layer disposed on the insulating encapsulant and electrically connected to the semiconductor die.

A method of fabricating a semiconductor package, comprising:

• forming a first package by:
• placing a semiconductor die on a carrier;
• forming an insulating encapsulant on the carrier and surrounding the semiconductor die, wherein the insulating encapsulant is formed from a molding composition comprising a stress relaxation agent composed of silicone oil, wherein the stress relation agent is at least one compound selected from the group of compounds represented by formula (1):
• wherein, in formula (1), X is independently CH3, C2H5, C3H7, C6H5, C10H7, C12H9, Y is independently CH3, C2H5, C3H7, C6H5, C10H7, C12H9, R is independently CH2, C2H4, C3H6, OCH2, OCH4, OC3H6, OC2H2, C2H2O, C3H4O, C4H6O, and n is 1-100;
• forming a redistribution layer disposed on the insulating encapsulant and electrically connected to the semiconductor die;
• and
• debonding the carrier.