Apriori application with dynamic digital correction (ddc) function
AssigneeApplied Materials, Inc.
InventorsShih-Hao KUO, Shih-Hsien LEE, Thomas L. LAIDIG, Jang Fung CHEN, Min Sheng SUEN
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AssigneeApplied Materials, Inc.
InventorsShih-Hao KUO, Shih-Hsien LEE, Thomas L. LAIDIG, Jang Fung CHEN, Min Sheng SUEN
Estimating the term…
Embodiments of the present disclosure generally relate to lithography systems. In one embodiment, a method is disclosed. The method includes measuring a location of a die pad of a die placed on a substrate and determining a die pad shift between an expected location of the die pad and the measured location of the die pad. The method also includes using the determined die pad shift and an expected via location to generate a shifted via location for a via electrically connecting to the die pad. The method further includes patterning the via at the shifted via location with a maskless lithography tool and utilizing a physical mask with a mask-based lithography tool to pattern a redistribution layer (RDL) pad electrically connected to the via patterned at the shifted via location with the maskless lithography tool.
A method, comprising:
A layer structure, comprising:
A non-transitory computer-readable medium storing instructions that, when executed by a processor, cause a computer system to perform the steps of:
Dependencies are inferred from the claim text.