Solid-state bonding method for the manufacture of semiconductor chucks and heaters

A layered assembly for use in a controlled atmosphere chamber, the layered assembly comprising:

• a plurality of substrates;
• at least one electrically functioning layer embedded between two adjacent substrates of the plurality of substrates, the electrically functioning layer comprising a material configured to secure the two adjacent substrates together using a solid-state bonding process;
• at least one electrical termination area integral with the at least one electrically functioning layer;
• and
• at least one peripheral sealing band embedded between and extending around a periphery of internal faces two adjacent substrates, the at least one peripheral sealing band comprising a material configured to secure and seal the two adjacent substrates together using the solid-state bonding process,
• wherein a plurality of dielectric regions are present between the two adjacent substrates and between edge boundaries of the at least one electrically functioning layer, the plurality of dielectric regions being sealed between the two adjacent substrates by the at least one peripheral sealing band.