Substrate correction device, substrate lamination device, substrate processing system, substrate correction method, substrate processing method, and semiconductor device manufacturing method

A substrate correction device comprising:

• an acquisition unit which acquires first information based on positional information of a plurality of alignment marks on a substrate, the alignment marks being measured externally;
• a stage which holds the substrate;
• a correction unit which corrects a misalignment between the substrate held by the stage, and another substrate to be bonded to the substrate;
• and
• a control unit which controls the correction unit based on the first information.

A substrate processing system comprising:

• a first measurement unit which measures positional information of a plurality of alignment marks on a substrate placed on a first stage, and outputs first information based on the measured positional information;
• a correction unit which corrects a misalignment between the substrate held by a second stage, and another substrate to be bonded to the substrate;
• and
• a control unit which controls the correction unit based on the first information.

A substrate correction method comprising:

• acquiring first information based on positional information of a plurality of alignment marks on a substrate;
• and
• correcting a misalignment between the substrate held by a first stage, and another substrate to be bonded to the substrate;
• and
• controlling the correcting based on the first information.

A substrate correction device comprising:

• an acquisition unit which acquires first information including information on a nonlinear component of a distortion of a first substrate, the first information being based on positional information of a plurality of alignment marks on a first substrate, the positional information being obtained by measuring the plurality of alignment marks on the first substrate by a measurement device;
• a stage which holds one substrate of the first substrate or a second substrate to be bonded to the first substrate;
• a measurement unit which measures a plurality of alignment marks on the one substrate;
• a deformation unit which deforms the one substrate held by the stage;
• and
• a control unit which controls the deformation unit based on the first information, and controls a position of the stage based on second information based on the positional information of the plurality of alignment marks on the one substrate, the positional information being obtained by measuring the plurality of alignment marks on the one substrate by the measurement unit, wherein
• a number of the plurality of alignment marks that are measured by the measurement unit is less than a number of the plurality of alignment marks that are measured by the measurement device.