Module tray for semiconductor device
AssigneeSamsung Electronics Co., Ltd.
InventorTaegeon Kim
Life of this patent
Estimating the term…
Abstract
A module tray for a semiconductor device includes a base plate, and first and second sidewalls extending in a vertical direction on the base plate to define an accommodating space in which a semiconductor substrate is accommodated. The first and second sidewalls include first and second support portions and first and second fastening grooves respectively. The first and second support portions have seating surfaces for supporting a lower surface of the semiconductor substrate in the accommodating space. The first and second fastening grooves respectively extend along the seating surfaces and are configured to temporarily fix the semiconductor substrate through predetermined shapes that correspond to both side portions of the semiconductor substrate.
Claims20
A module tray for a semiconductor device, comprising:
- a base plate;
- and
- first and second sidewalls extending in a vertical direction from the base plate and defining an accommodating space in which a semiconductor substrate is accommodated,
- wherein the first and second sidewalls include first and second support portions and first and second fastening grooves respectively,
- wherein the first and second support portions have seating surfaces for supporting a lower surface of the semiconductor substrate in the accommodating space, and
- wherein the first and second fastening grooves respectively extend along the seating surfaces and are configured to temporarily fix the semiconductor substrate within the module tray.
A module tray for a semiconductor device, comprising:
- a base plate;
- and
- first and second sidewalls extending in a vertical direction from the base plate and defining an accommodating space in which a semiconductor substrate is accommodated,
- wherein the first and second sidewalls include:
- first and second support portions having first and second seating surfaces for supporting a lower surface of the semiconductor substrate;
- and
- first and second fastening grooves respectively extending along the first and second seating surfaces,
- wherein the first and second fastening grooves respectively have first and second shapes that correspond to first and second side portions of the semiconductor substrate, and
- wherein the first and second fastening grooves are configured to engage to or separate from the first and second side portions of the semiconductor substrate through the first and second shapes.
A module tray for a semiconductor device, comprising:
- a base plate;
- first and second sidewalls extending in a vertical direction from the base plate and defining an accommodating space in which a semiconductor substrate is accommodated;
- and
- third and fourth sidewalls extending in the vertical direction from the base plate between the first and second sidewalls,
- wherein the first and second sidewalls include:
- first and second support portions having first and second seating surfaces for supporting a lower surface of the semiconductor substrate;
- and
- first and second fastening grooves respectively extending along the first and second seating surfaces,
- wherein the first and second fastening grooves respectively have first and second shapes that correspond to first and second side portions of the semiconductor substrate,
- wherein the first and second fastening grooves are configured to engage to or separate from the first and second side portions of the semiconductor substrate through the first and second shapes,
- wherein the third and fourth sidewalls include:
- third and fourth support portions having third and fourth seating surfaces disposed on a same plane as the first and second seating surfaces;
- and
- third and fourth fastening grooves respectively extending along the third and fourth seating surfaces,
- wherein the third and fourth fastening grooves respectively have third and fourth shapes that correspond to third and fourth side portions of the semiconductor substrate, and
- wherein the third and fourth fastening grooves are configured to engage to or separate from the third and fourth side portions of the semiconductor substrate through the third and fourth shapes.
Dependencies are inferred from the claim text.