Substrate processing apparatus and substrate processing method using the same

A substrate processing apparatus, comprising:

• a process chamber;
• a support member in the process chamber, the support member supporting a substrate;
• a lower electrode below the support member;
• an upper electrode above the support member and spaced apart from the support member;
• and
• a heater in the process chamber,
• wherein the heater is disposed to horizontally surround a process space, the process space being between the support member and the upper electrode.

A substrate processing method, comprising:

• placing a substrate in a substrate processing apparatus;
• and
• processing the substrate disposed in the substrate processing apparatus,
• wherein the substrate processing apparatus includes:
• a support member that supports the substrate;
• a lower electrode below the support member;
• an upper electrode above the support member and spaced apart from the support member;
• and
• a heater that horizontally surrounds a space between the support member and the upper electrode,
• wherein processing the substrate includes:
• using the heater to heat the substrate on the support member;
• and
• applying a power to at least one electrode of the lower electrode or the upper electrode.