Single and Multiple Pole Magnetics Module Integral to Power Converter Module

In one first exemplary embodiment, a single or multi-pole discrete magnetic device assembly or structure with a substrate containing windings and conductive traces which is inserted and integrated into a separate main power-processing structure and assembly with a substrate which contains the power semiconductor components and other components necessary for the processing of electrical power, and at said interface and insertion points, the substrate layers of each are comprised of top, bottom and inner layers interleaved for high frequency, high current flow and return on adjacent layers and alternating layers and positions in countervailing directions, wherein:

• the discrete magnetic device assembly or structure includes at least one magnetic pole piece or post, in one aspect, ferromagnetic, at least one substrate layer which contains the windings or conductive trace elements of the magnetic device, apertures in the substrate layer into which are inserted the magnetic pole pieces, a magnetic baseplate which secures in position the magnetic pole pieces and a magnetic top plate which forms a cover and return path for the magnetic flux;
• the discrete magnetic device assembly or structure is 1-pole, 2-pole or multiple n-poles which encompasses the number of magnetic pole pieces or posts and apertures into which the pole pieces are inserted;
• the discrete magnetic device substrate contains at least one output terminal, at least one input terminal, and may include at least one intermediate terminal;
• the separate main power-processing assembly substrate has at least one cut-out into which the discrete magnetic device assembly is to be inserted, at least one terminal position, plated thru-hole or conductive via or pad, into which will be inserted at least one of the discrete magnetic device assembly input terminals, at least one terminal position into which will be inserted at least one of the discrete magnetic device assembly output terminals, and may include at least one intermediate terminal position into which will be inserted at least one of the discrete magnetic device assembly intermediate terminals;
• there is at least one separate main power-processing assembly substrate Input-Side area or region and point of interface and electrical connection consisting typically of winding terminations, power semiconductors and power components into which is inserted the magnetic device structure, said region and interface which is comprised of top, bottom and inner layers of the substrate interleaved for high frequency, high current flow and return on adjacent layers and alternating layers and positions in countervailing directions;
• there is at least one separate main power-processing assembly substrate Output-Side area or region and point of interface and electrical connection consisting typically of winding terminations, power semiconductors and power components into which is inserted the magnetic device structure, said region and interface which is comprised of top, bottom and inner layers of the substrate interleaved for high frequency, high current flow and return on adjacent layers and alternating layers and positions in countervailing directions;
• there may be at least one Intermediate area or region and point of interface and electrical connection consisting in one aspect, of winding terminations, power semiconductors and power components into which is inserted the magnetic device structure, said region and interface which is comprised of top, bottom and inner layers of the substrate interleaved for high frequency, high current flow and return on adjacent layers and alternating layers and positions in countervailing directions.