US 2024/0403253 A1 · METHODS TO EXTEND NOC INTERCONNECT ACROSS MULTIPLE DICE IN 3D

Abstract

Embodiments herein describe techniques to extend a network-on-chip (NoC) across multiple IC dice in 3D. An integrated circuit (IC) device includes first and second vertically-stacked IC dice, and an inter-die bus that interfaces between the second die and a NoC packet switch (NPS) of the first die. The inter-die bus may include one or more driver circuits coupled to inter-die links of the inter-die bus. Communications over the inter-die links may be synchronous (e.g., packet-based) or asynchronous with the NPS (e.g., based on a point-to-point protocol, such as an AXI protocol). The inter-die bus may interface with a circuit block of the second IC device via a point-to-point (e.g., AXI) protocol or via a NPS of the second IC die. The IC device may include multiple inter-die buses, which may expand inter-die and intra-die routing options

Claims20

Dependent claims

An integrated circuit (IC) device, comprising:

first and second vertically-stacked IC dice, wherein the first IC die comprises network-on-chip (NoC) circuitry;
and
an inter-die bus configured to interface between the packet-switched NoC and the second IC die, wherein the inter-die bus comprises a first driver circuit coupled to inter-die links of the inter-die bus.

Dependencies are inferred from the claim text.

Facts

Application

18/204,246Filed 31 May 2023

Published

5 Dec 2024

Term ends

Not estimatedThe source records don’t support an estimate.

Classification5 codes

G06F 13/4072
Electrical coupling: drivers or receivers
G06F 15/7825
System on chip, i.e. computer system on a single chip; System in package, i.e. computer system on one or more chips in a single package: globally…
G06F 13/4022
Coupling between buses: using switching circuits, e.g. switching matrix, connection or expansion network
G06F 13/4265
Bus transfer protocol, e.g. handshake; Synchronisation: on a point to point bus

Methods to extend noc interconnect across multiple dice in 3d

Life of this patent

Methods to extend noc interconnect across multiple dice in 3d

Life of this patent

Abstract

Claims20