Inertial Sensor Apparatus
AssigneeSeiko Epson Corporation
InventorTeruo TAKIZAWA
Life of this patent
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Abstract
An inertial sensor apparatus includes: a base substrate; and a stacked body bonded to the base substrate by a first junction. The stacked body includes: a first inertial sensor that outputs a first detection signal in accordance with an inertial force; a processing circuit that drives the first inertial sensor and that processes the first detection signal; and a second junction that is positioned between the first inertial sensor and the processing circuit and that bonds the first inertial sensor to the processing circuit. A thermal conductivity of the second junction is higher than a thermal conductivity of the first junction.
Claims9
An inertial sensor apparatus comprising:
- a base substrate;
- and
- a stacked body bonded to the base substrate by a first junction,
- the stacked body including
- a first inertial sensor that outputs a first detection signal,
- a processing circuit that drives the first inertial sensor and that processes the first detection signal, and
- a second junction that bonds the first inertial sensor to the processing circuit, the second junction being positioned between the first inertial sensor and the processing circuit,
- a thermal conductivity of the second junction being higher than a thermal conductivity of the first junction.
Dependencies are inferred from the claim text.