Stacked memory device with interface die

A memory module comprising:

• a data bus interface for coupling to a memory controller via a data bus;
• and
• a set of stacked memory devices coupled to the data bus interface, wherein each of the set of stacked memory devices comprises:
• a set of dies arranged in a stack and comprising respective core memories;
• an interface die in the stack, the interface die including:
• encoding/decoding logic to decode write data received from the data bus and to encode read data for outputting to the data bus;
• and
• read/write driver logic to receive the decoded write data from the encoding/decoding logic and to distribute the decoded write data to the respective core memories, and to receive the read data from the respective core memories for providing to the encoding/decoding logic.

A method for operating a stacked memory device, the method comprising:

• receiving, at an interface die of the stacked memory device from a data bus, a write command and encoded write data for writing to the memory device;
• decoding, by encoding/decoding logic of the interface die, the encoded write data to generate decoded write data;
• writing, by read/write logic of the interface die, different subsets of bits of the decoded write data to different core memories in different dies of the stacked memory arranged in a stack;
• receiving, at the interface die of the stacked memory device, a read command for reading from the stacked memory device;
• obtaining different subsets of bits of read data from the different core memories in the different dies of the stacked memory device responsive to the read command;
• aggregating, by the read/write logic of the interface die, the different subset of bits of the read data to generate aggregated read data;
• encoding, by the encoding/decoding logic of the interface die, the aggregated read data into encoded read data;
• and
• outputting, by the encoding/decoding logic, the encoded read data to the data bus.