Photosensitive resin composition, photosensitive resin film, multilayered printed wiring board, semiconductor package, and method for producing multilayered printed wiring board

Abstract

Provided is a photosensitive resin composition containing: (A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent; (B) a (meth)acrylate compound having two or more (meth)acryloyl groups; (C) a compound having two or more ethylenically unsaturated groups other than the (meth)acryloyl groups; (D) a photopolymerization initiator, and (E) an organic peroxide.

Dependencies are inferred from the claim text.