Semiconductor device and methods of manufacture

A photoresist comprising:

• a first solvent;
• a second solvent having a boiling point at least 20° C. greater than the first solvent;
• a third solvent that is more hydrophilic than the first solvent;
• a polymer resin;
• one or more photoactive compounds (PACs);
• and
• a surfactant.

A photoresist comprising:

• a solvent mixture comprising:
• a base solvent;
• one or more boiling point modifying solvents, wherein a boiling point of the solvent mixture is greater than a boiling point of the base solvent, and wherein an evaporation rate of the solvent mixture is lower than an evaporation rate of the base solvent;
• one or more hydrophilicity modifying solvents, wherein a hydrophobic property of the solvent mixture is lower than a hydrophobic property of the base solvent;
• a polymer resin;
• a photoactive compound (PAC);
• and
• a surfactant.