Probe system for testing of devices under test integrated on a semiconductor wafer, and probe card, probe head, and guiding plate structure therein

Abstract

A probe system and a probe card, a probe head and a guide plate structure thereof are described herein. The probe head includes a plurality of probes and guide plates. Each probe includes a first end, a second end, and a probe body. The first end is configured to abut a contact pad of the device under test. The second end is configured to abut a contact pad of a board of the probe system. The probe body extends between the first end and the second end according to a longitudinal development axis. The guide plate includes a pair of first guide holes for a pair of probes to pass through, and the pair of first guide holes are configured to slidably accommodate the pair of probes. The material between the pair of first guide holes in the guide plate has a relative dielectric constant not greater than 6, so as to reduce the return loss between the probe head and the device under test.

Dependencies are inferred from the claim text.