Thermally conductive film

A thermally conductive film, comprising:

• a silicone resin (A) at 100 parts by mass, the silicone resin being one or more selected from the following formula (1) or (2):
• DmTφpDVin (1)
• wherein D represents a siloxane unit represented by (CH3)2SiO2/2, Tφ represents a siloxane unit represented by (C6H5)SiO3/2, DVi represents a siloxane unit represented by (CH3)(CH2═CH)SiO2/2, “m” represents an integer of 35 to 55, “n” represents an integer of 30 to 60, “p” represents an integer of 40 to 70, (m+n)/m=1.0 to 4.0, and (m+n)/p=0.25 to 4.0;
• MLDxTφqDViy (2)
• wherein M represents (CH3)3SiO1/2, D, Tφ, and DVi represent the same as above, L represents an integer of 10 to 30, “x” represents an integer of 15 to 35, “y” represents an integer of 40 to 60, “q” represents an integer of 45 to 55, L/(x+y)=0.001 to 0.4, (x+y)/x=1.0 to 4.0, and (x+y)/q=0.25 to 4.0,
• the silicone resin having non-flowability at 25° C.;
• a wax (B) having a melting point of 20 to 60° C. at 5 to 300 parts by mass, the melting point being measured with a differential scanning calorimeter in accordance with JIS K7121:2012;
• and
• a thermally conductive filler (C) at 1,000 to 6,000 parts by mass relative to 100 parts by mass of the component (A).