US 2024/0392048 A1Published application

Polymer, photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for forming wiring pattern

OwnerHiroshi MATSUTANI, Bao LI +5inventors

InventorsHiroshi MATSUTANI, Bao LI, Yasuharu MURAKAMI, Masato MIYATAKE, Akitoshi TANIMOTO, Xuesong JIANG, Xiao-dong MA

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Abstract

An aspect of the present disclosure relates to a polymer including a structural unit represented by the following Formula (I) and a structural unit having a carboxy group. In Formula (I), R1 represents a hydrogen atom or a methyl group; M represents an alkylene group or an alkylene oxide chain; and R2 represents an alkyl group or an aryl group.

Claims13

Dependent claims

A polymer comprising a structural unit represented by the following Formula (I) and a structural unit having a carboxy group:

wherein in Formula (I), R1 represents a hydrogen atom or a methyl group;
M represents an alkylene group or an alkylene oxide chain;
and R2 represents an alkyl group or an aryl group.

Dependencies are inferred from the claim text.

Facts

Application: 18/695,159Filed 28 Sep 2021
Published: 28 Nov 2024
Term ends: Not estimatedThe source records don’t support an estimate.

Classification11 codes

C08F 212/08
Hydrocarbons: styrene
C09D 4/06
Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable…:…
C08F 265/06
On to polymers of esters: polymerisation of acrylate or methacrylate esters on to polymers thereof
G03F 7/031
With photosensitivity-increasing substances, e.g. photoinitiators: organic compounds not covered by group G03F7/029

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