Sandpaper replacement system

A method, comprising:

• determining, by a system and in association with semiconductor processing, that a surface of a plate is sufficiently flat;
• removing, by the system, a liner from a sandpaper sheet to expose an adhesive surface of the sandpaper sheet;
• affixing, by the system, the sandpaper sheet to the surface of the plate using the adhesive surface of the sandpaper sheet;
• determining, by the system, whether a surface of the sandpaper sheet is sufficiently flat for the semiconductor processing after the sandpaper sheet is affixed to the surface of the plate;
• and storing the plate after the sandpaper sheet is affixed to the surface of the plate.

A method, comprising:

• loading, by a system, a plate to which a sandpaper sheet is to be affixed to a surface of the plate in association with semiconductor processing;
• affixing, by the system, the sandpaper sheet to the surface of the plate using an adhesive surface of the sandpaper sheet;
• determining, by the system, whether a surface of the sandpaper sheet is sufficiently flat for the semiconductor processing;
• and
• storing the plate after the sandpaper sheet is affixed to the surface of the plate, based on whether the surface of the sandpaper sheet is sufficiently flat.