Polishing pad

2:

• The polishing pad according to claim 1, wherein the thermoplastic polyurethane includes, in a total amount of the organic diisocyanate unit, 90 to 100 mol % of 4,4′-diphenylmethane diisocyanate unit serving as the non-alicyclic diisocyanate unit.

3:

• The polishing pad according to claim 1, wherein the polyurethane composition contains 99 to 99.9 mass % of the thermoplastic polyurethane, and 0.1 to 1 mass % of the hygroscopic polymer.

4:

• The polishing pad according to claim 1, wherein the hygroscopic polymer includes at least one selected from the group consisting of a polyethylene oxide (PEO), a polypropylene oxide (PPO), a PEO-PPO copolymer, a PEO-PPO block copolymer, and a polyester-based thermoplastic elastomer (TPEE).

5:

• The polishing pad according to claim 1, wherein the hygroscopic polymer has a weight-average molecular weight of 70,000 to 4,000,000.

6:

• The polishing pad according to claim 1, wherein the molded body has a saturated swollen state-breaking elongation of 250 to 400% when swollen to saturation with water at 50° C.

7:

• The polishing pad according to claim 6, wherein the molded body has a dry state-breaking elongation of 150 to 250% at a humidity of 48 RH % and 23° C.

8:

• The polishing pad according to claim 7, wherein the molded body has a ratio S1/S2 of 1.0 to 2.0, where S1 represents the saturated swollen state-breaking elongation and S2 represents the dry state-breaking elongation.

9:

• The polishing pad according to claim 1, wherein the molded body, in a form of a sheet having a thickness of 0.5 mm, has a laser light transmittance of 60% or more for 550-nm wavelength when swollen to saturation with water at 50° C.

10:

• The polishing pad according to claim 1, wherein the molded body has a Vickers hardness of 5 or more and less than 21.

11:

• The polishing pad according to claim 1, wherein the molded body has a storage modulus of 0.1 to 1.0 GPa when swollen to saturation with water at 50° C.

12:

• The polishing pad according to claim 1, wherein the molded body is an unfoamed molded body.

13:

• The polishing pad according to claim 1, wherein a content ratio of the non-alicyclic diisocyanate unit contained in a total amount of the organic diisocyanate units contained in the thermoplastic polyurethane is 90 to 100 mol %.

14:

• The polishing pad according to claim 4, wherein a content ratio of the non-alicyclic diisocyanate unit contained in a total amount of the organic diisocyanate units contained in the thermoplastic polyurethane is 90 to 100 mol %.

15:

• The polishing pad according to claim 1, wherein a content ratio of the non-alicyclic diisocyanate unit contained in a total amount of the organic diisocyanate units contained in the thermoplastic polyurethane is 95 to 100 mol %.

16:

• The polishing pad according to claim 4, wherein a content ratio of the non-alicyclic diisocyanate unit contained in a total amount of the organic diisocyanate units contained in the thermoplastic polyurethane is 95 to 100 mol %.

17:

• The polishing pad according to claim 1, wherein a content ratio of the non-alicyclic diisocyanate unit contained in a total amount of the organic diisocyanate units contained in the thermoplastic polyurethane is 100 mol %.

18:

• The polishing pad according to claim 4, wherein a content ratio of the non-alicyclic diisocyanate unit contained in a total amount of the organic diisocyanate units contained in the thermoplastic polyurethane is 100 mol %.

19:

• The polishing pad according to claim 1, wherein the hygroscopic polymer has a weight-average molecular weight of 5,000 to 10,000,000.