Method for grinding semiconductor wafers

A method for grinding a semiconductor wafer, the method comprising:

• processing the semiconductor wafer so as to remove material by grinding with a grinding tool, the grinding tool comprising grinding teeth having a height h, while delivering a coolant into a contact region between the rotating semiconductor wafer and the grinding tool;
• at each instant of the grinding, a first coolant flow rate is applied onto a first region on one side of the semiconductor wafer by one or more nozzles;
• and
• at each instant of the grinding, a second coolant flow rate is applied onto a second region on the one side of the semiconductor wafer by one or more nozzles,
• wherein the first region is bounded by a lower right quadrant of the semiconductor wafer and the second region is bounded by a lower left quadrant, and wherein a ratio of the first coolant flow rate and a sum of the first coolant flow rate and the second coolant flow rate is no more than 35% and no less than 25%.