Fly-cut apparatus
AssigneeTokyo Seimitsu Co., Ltd.
InventorKazumasa ISHIKAWA
Life of this patent
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Abstract
A fly-cut apparatus to process a work with bumps on a front surface. A fly-cut apparatus cuts an upper surface of a BG film laminated to a work including a bump region with bumps formed on a front surface and an outer peripheral region around the bump region. The fly-cut apparatus includes a fly-cut tool, a tool spindle with a lower end to which the fly-cut tool is attached, and capable of ascending and descending in a state of rotating the fly-cut tool, and a chuck which rotatably retains the work, and the fly-cut tool cuts the upper surface of the BG film from a center toward an outer perimeter.
Claims5
A fly-cut apparatus which cuts an upper surface of a protective film laminated to a work including a bump region with bumps formed on a front surface and an outer peripheral region around the bump region, the apparatus comprising:
- a fly-cut tool;
- a tool spindle with a lower end to which the fly-cut tool is attached, and capable of ascending and descending in a state of rotating the fly-cut tool;
- and
- a chuck which rotatably retains the work, wherein
- the fly-cut tool cuts the upper surface of the protective film from a center toward an outer perimeter.
Dependencies are inferred from the claim text.