Connection line structure and forming method thereof
AssigneeWuhan Neuracom Technology Development Co., Ltd.
InventorsLi HUANG, Cheng HUANG, Zhanfeng MA, Yaqin WANG, Chunshui WANG, Jianfei GAO
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AssigneeWuhan Neuracom Technology Development Co., Ltd.
InventorsLi HUANG, Cheng HUANG, Zhanfeng MA, Yaqin WANG, Chunshui WANG, Jianfei GAO
Estimating the term…
Disclosed are a connection line structure and a forming method thereof. The connection line structure includes a passivation layer, a metal layer, and a protective layer, the metal layer is arranged on the passivation layer, and the protective layer is arranged on the metal layer. In the present application, a simple single-layer wiring design may be utilized, and a multi-layer three-dimensional wiring design may also be utilized to implement high speed transmission, a MEMS process allows for design of a connection line in a straight or bent layout, a connection line of a bent layout is flexible, and better compatibility is achieved.
A connection line structure, comprising a passivation layer, a metal layer and a protective layer, wherein the metal layer is provided on the passivation layer, and the protective layer is provided on the metal layer.
A method for forming a connection line structure, comprising:
Dependencies are inferred from the claim text.