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US 2024/0351168 A1Published application
Metal-bonded grinding wheel
AssigneeAsahi Diamond Industrial Co., Ltd.
InventorsYoshinori NAKANE, Manabu SATO, Masanori NAKA, Ryuichi TAKANABE
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Abstract
There is provided a metal-bonded grinding stone including an abrasive grain layer in which a plurality of abrasive grains and a plurality of pores are dispersed in a metal bonding material, in which a porosity of the plurality of pores in the abrasive grain layer is 40% or more and 99% or less.
Claims14
A metal-bonded grinding stone comprising
- an abrasive grain layer in which a plurality of abrasive grains and a plurality of pores are dispersed in a metal bonding material,
- wherein a porosity of the plurality of pores in the abrasive grain layer is 40% or more and 99% or less.
Dependencies are inferred from the claim text.